(Download) "Wire Bonding in Microelectronics, 3/E" by George Harman " Book PDF Kindle ePub Free
eBook details
- Title: Wire Bonding in Microelectronics, 3/E
- Author : George Harman
- Release Date : January 05, 2009
- Genre: Engineering,Books,Professional & Technical,
- Pages : * pages
- Size : 15502 KB
Description
The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updated
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates—a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.
Wire Bonding in Microelectronics, Second Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping,
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